Intel's SMARTi UE2p will offer lower footprint and reduce the cost of mobile chip besides offering 3G connectivity.
Intel has announced a new low cost 3G solution for mobile phones, tablets and machine to machine connectivity. Called SMARTi UE2p, it is a radio frequency solution that integrates 3G power amplifiers into radio frequency circuits. The new system-on-chip (SoC) solution enables a smaller footprint and reduces complexity for developers as well as the associated total cost of ownership.
"The SMARTi UE2p will simplify the product development and supply chain logistics with the reduction in component count and system complexity," said Stefan Wolff, vice president of the Intel architecture group and general manager of Multi-Com.
"This will allow our customers to introduce lower-cost 3G handsets and support the transition of the machine-to-machine (example: fridge with connectivity) market segment toward 3G-based connected devices to help enable the 'Internet of things," Stefan added.
The new technology reduces number of components and even allows power management, which is normally done by a separate chip currently.
This solution is targeted at new mass market segments such as sub-Rs 5000 level 3G handsets and machine-to-machine modules that allows connectivity for fridge, washing machine etc to let them directly order supplies when they run out, or to inform you the same.
This will also enable low cost tablets to offer 3G connectivity which are currently only on WiFi.
Samples of the tech will start to reach manufacturers by end of this year and is expected to start shipping to consumers by beginning of 2013.
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